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これらの寸法は，主として
and unpacking and relocation of semiconductor manufacturing equipment (SME) to the customer’s cleanroom manufacturing area
This Standard utilizes SEMI E37/SEMI E37
ESDによる製品，レチクルおよび装置の損傷を低減する。
E16600 - SEMI E166 - Specification for 450 mm Cluster Module Interface: Mechanical Interface and Transport Standard StdTpc-Device Tracking これらの寸法は，主としてThe purpose of this Standard is to ensure minimum necessary level of physical connectivity between the transport module and process modules comprising the cluster tool for 450 mm. It is expected that a process module can be connected to the transport module of any cluster tool with least design change provided that both modules meet the requirement of this Standard. Process modules accept wafers at locations that may vary substantially from one module
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